Preparation of the Thicker ~(241,243)Am Targets by Molecular Plating Method
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Abstract
Electrodeposition of americium ( 241 Am and 243 Am) from the mixture of isopropyl alcohol and dilute nitric acid is studied by molecular plating procedure. Under the condition of voltage of 550 V and the current density of 4~6 mA/cm 2, electrodeposition lasts one hour, and the 241,243 Am targets with thickness of 0.6~1.2 mg/cm 2 is obtained on thin aluminum foil by a single molecular plating.
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