钽靶托在64Cu核素制备工艺中的应用

The Application of Tantalum Target Substrate for Production Process of 64Cu

  • 摘要: 为了获得适用于64Cu核素生产的靶托材料,解决采用铜靶托时氯化铜64Cu最终产品中非放射性铜杂质含量易超标的问题,获得满足放射性标记要求的氯化铜64Cu溶液,选用金属钽作为靶托材料,对钽靶托进行热流固耦合分析、镀镍、溶解、辐照以及坠落、热冲击等实验研究,利用钽靶托进行64Cu核素的实际生产。结果表明,钽靶托可应用于64Cu核素制备,并可简化64Cu核素生产工艺,产能可达38.1 GBq(EOB),产额可达190.5 MBq·μA-1·h-1(EOB)。所得氯化铜64Cu溶液的放射性核纯度>99.9%,放化纯度>95%,金属杂质含量均低于1.5 μg·GBq-1。本研究验证了钽靶托可应用于64Cu核素生产,避免了镀金工艺,可更高效地进行64Cu生产。

     

    Abstract: In order to obtain the appropriate target backing material for 64Cu production which will meet radiolabeling requirements, and to reduce the content of stable copper impurity generated from copper target substrate in the final 64Cu product, tantalum is selected as the target backing material. By carrying out a series of experiments including thermal fluid solid coupling analysis, nickel plating experiment, dissolution experiment, irradiation experiment, falling test, thermal shock test on the tantalum target substrate, tantalum target substrate is finally utilized for 64Cu production. The results showed that tantalum target substrate could be applied to 64Cu production, which has simplified the whole production process of 64Cu, the yield can reach 38.1 GBq (EOB) or 190.5 MBq·μA-1·h-1 (EOB). The tests of 64CuCuCl2 solution showed that the radionuclide purity was greater than 99.9%, radiochemical purity was greater than 95% and the metal impurity content was less than 1.5 μg·GBq-1. The research verifies that the tantalum target substrate can be used in 64Cu production, which avoids the process of electroplating gold and produces 64Cu more efficiently.

     

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